Kandou
Swiss startup founded in 2011 in Lausanne. Develops chip-to-chip interconnect chips and IP to solve the memory bottleneck in AI systems. $225M Series A in March 2026.
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About Kandou
The bottleneck in AI performance is not compute power — it's the speed at which data moves between chips and memory. Kandou has developed a proprietary interconnect technology (called Chord Signaling) that dramatically increases available bandwidth between AI processors and HBM memory, solving one of the most critical problems in AI systems for datacentres. Series A funding round of $225M (2026).
How Kandou works
Business Model
Interconnect IP licensing to chip designers and hyperscalers. Similar model to ARM.
Market & Clients
Geographic Presence
Funding & Investors
Funding Rounds
- 2026 - Series A: $225M
Key Metrics
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- Kandou — $225M Series A 2026 — Tech.eu